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1

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Jingook Kim, Rotaru, M.D., Seungyong Baek, Jongbae Park, Iyer, M.K., Joungho Kim

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2006

Language:

english

File:

PDF, 1.49 MB

english, 2006

2

Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection

Namhoon Kim,, Myunghee Sung,, Hyungsoo Kim,, Seungyong Baek,, Woonghwan Ryu,, Jeong-Gyun An,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 176 KB

english, 2001

3

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect

Seungyong Baek,, Seungyoung Ahn,, Jongbae Park,, Joungho Kim,, Jonghoon Kim,, Jeong-hyeon Cho,

Year:

2004

Language:

english

File:

PDF, 367 KB

english, 2004

4

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module

Jongbae Park,, Hyungsoo Kim,, Jun So Pak,, Youchul Jeong,, Seungyong Baek,, Joungho Kim,, Jung-Joon Lee,, Jae-Joon Lee,

Year:

2004

Language:

english

File:

PDF, 377 KB

english, 2004

5

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Compensation of ESD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications

Seungyoung Ahn,, Seungyong Baek,, Junho Lee,, Joungho Kim,

Year:

2004

Language:

english

File:

PDF, 368 KB

english, 2004

6

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB

Dong Gun Kam,, Heeseok Lee,, Seungyong Baek,, Bongcheol Park,, Joungho Kim,

Year:

2002

Language:

english

File:

PDF, 299 KB

english, 2002

7

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Open load backward matching (OLBM) technique for low ISI differential H-tree clock and data transmission

Daehyun Chung,, Seungyong Baek,, Joungho Kim,

Year:

2003

Language:

english

File:

PDF, 213 KB

english, 2003

8

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises

Dong Gun Kam,, Heeseok Lee,, Seungyong Baek,, Bongcheol Park,, Joungho Kim,

Year:

2002

Language:

english

File:

PDF, 858 KB

english, 2002

9

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

Seungyong Baek,, Dong Gun Kam,, Bongcheol Park,, Joungho Kim,, Jung-Gun Byun,, Cheol-Seung Choi,

Year:

2002

Language:

english

File:

PDF, 325 KB

english, 2002

10

[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Measurement and correlation-based methodology for estimating worst-case skew due to glass weave effect

Nalla, Kartheek, Koul, Amendra, Baek, Seungyong, Sapozhnikov, Mike, Maghlakelidze, Giorgi, Fan, Jun

Year:

2017

Language:

english

File:

PDF, 1.97 MB

english, 2017

11

Motion retargeting and evaluation for VR-based training of free motions

Seongmin Baek, Seungyong Lee, Gerard Jounghyun Kim

Journal:

The Visual Computer

Year:

2003

Language:

english

File:

PDF, 1.20 MB

english, 2003

12

Antioxidant and Apoptotic Effects of Korean White Ginseng Extracted with the Same Ratio of Protopanaxadiol and Protopanaxatriol Saponins in Human Hepatoma HepG2 Cells

Myoungsook Lee, Sungbin Sorn, Seungyong Baek, Soojung Jang, Sungsoo Kim

Journal:

Annals of the New York Academy of Sciences

Year:

2009

Language:

english

File:

PDF, 368 KB

english, 2009

13

[IEEE 2008 IEEE 17th Conference on Electrical Performance of Electronic Packaging (EPEP) - San Jose, CA, USA (2008.10.27-2008.10.29)] 2008 IEEE-EPEP Electrical Performance of Electronic Packaging - A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin

Changwook Yoon,, Seungyong Baek,, HyungRok Lee,, Youchul Jeong,, Jongbae Park,, Hyunjeong Park,, Baegin Sung,, Joungho Kim,

Year:

2008

Language:

english

File:

PDF, 519 KB

english, 2008

14

[IEEE 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop - Boston, MA, USA (4-6 May 2004)] 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) - A study on rapid development and ramp-up of high density DRAM using an advanced e-beam inspection system

Jongpil Lee,, Hyunchul Baek,, Yongwook Song,, Paul Seungyong Lee,, Gasser, D., Price, D.W.

Year:

2004

Language:

english

File:

PDF, 404 KB

english, 2004

15

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Over GHz frequency model of commercial 2mm hard metric connector using on-board calibration standards

Seungyong Baek,, Bong Cheol Park,, Dong Gun Kam,, Joungho Kim,

Year:

2002

Language:

english

File:

PDF, 517 KB

english, 2002

16

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk

Dong Gun Kam,, Seungyoung Ahn,, Seungyong Baek,, Bongcheol Park,, Myunghee Sung,, Joungho Kim,

Year:

2002

Language:

english

File:

PDF, 663 KB

english, 2002

17

[IEEE 2011 Eighth International Conference on Information Technology: New Generations (ITNG) - Las Vegas, NV, USA (2011.04.11-2011.04.13)] 2011 Eighth International Conference on Information Technology: New Generations - An Implementation of AODV Testbed with Multi-metrics

Yun, Jangkyu, Lee, Byunghwa, Baek, Youngmi, Kim, Junhyung, Han, Jihun, Oh, Seungyong, Hwang, Seonhwan, Han, Kijun

Year:

2011

Language:

english

File:

PDF, 540 KB

english, 2011

18

[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Compensation of unbalanced capacitive crosstalk noise in category-5E modular jack using balancing capacitor in PCB

Namhoon Kim,, Myunghee Sung,, Hyungsoo Kim,, Seungyong Baek,, Woonghwan Ryu,, Joungho Kim,

Year:

2000

Language:

english

File:

PDF, 234 KB

english, 2000

19

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Characterization of power delivery network by using optimized power/ground port termination impedance

Brian, Seungyong Baek, Lai, Jiali, Agrawal, Amit

Year:

2013

Language:

english

File:

PDF, 920 KB

english, 2013

20

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Behavioral model of switching DC-DC converter for improving power delivery network design

Baek, Seungyong, Pun, Philip, Agrawal, Amit

Year:

2012

Language:

english

File:

PDF, 598 KB

english, 2012

21

[IEEE 2007 IEEE Electrical Performance of Electronic Packaging - Atlanta, GA, USA (2007.10.29-2007.10.31)] 2007 IEEE Electrical Performance of Electronic Packaging - Computation of Intra-pair Skew for Imbalance Differential Line using Modified Mixed-mode S-parameter

Baek, Seungyong, Lee, Eric, Sung, Baegin

Year:

2007

Language:

english

File:

PDF, 1.89 MB

english, 2007

22

[IEEE 2010 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery (CyberC) - Huangshan, China (2010.10.10-2010.10.12)] 2010 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery - Network Initialization for Wireless Distributed Beaconing Networks

Baek, Youngmi, Kim, Youngil, Lee, Byunghwa, Lee, Jilong, Yun, Jeongbae, Shu, Qin, Oh, Seungyong, Han, Kijun

Year:

2010

Language:

english

File:

PDF, 1.10 MB

english, 2010

23

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - 10Gbps Backplane Design Methodology with Sensitivity Analysis and Statistical Analysis

Jaemin Kim,, Seungyong Baek,, Hyunjeong Park,, Sukho Kim,, Youngsoo Hong,, Dongsoon Lim,, Joungho Kim,

Year:

2005

Language:

english

File:

PDF, 3.14 MB

english, 2005

24

[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Micromachined picosecond optical near-field probe for pulse-coupling measurement of interconnection lines

Jongjoo Lee,, Heeseok Lee,, Seungyong Baek,, Yuchul Jung,, Joungho Kim,

Year:

2000

Language:

english

File:

PDF, 230 KB

english, 2000

25

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board

Seungyong Baek,, Dong Gun Kam,, Bongcheol Park,, Joungho Kim,, Jung-Gun Byun,, Cheol-Seung Choi,

Year:

2002

File:

PDF, 325 KB

2002

26

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Design and estimation of embedded passives in multiple line grid array (MLGA) package

Junho Lee,, Seungyoung Ahn,, Seungyong Baek,, Joungho Kim,, Young-Soo Kim,, Yoon, C.K.

Year:

2000

Language:

english

File:

PDF, 501 KB

english, 2000

27

Development of biocathode during repeated cycles of bioelectrochemical conversion of carbon dioxide to methane

Baek, Gahyun, Kim, Jinsu, Lee, Seungyong, Lee, Changsoo

Journal:

Bioresource Technology

Year:

2017

Language:

english

File:

PDF, 774 KB

english, 2017

28

Extended Use of Extracorporeal Membrane Oxygenation for Acute Respiratory Distress Syndrome: A Retrospective Multicenter Study

Kim, Won-Young, Park, SeungYong, Kim, Hwa Jung, Baek, Moon Seong, Chung, Chi Ryang, Park, So Hee, Kang, Byung Ju, Oh, Jin Young, Cho, Woo Hyun, Sim, Yun Su, Cho, Young-Jae, Park, Sunghoon, Kim, Jung-H

Journal:

Tuberculosis and Respiratory Diseases

Year:

2019

Language:

english

File:

PDF, 395 KB

english, 2019

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